Price:
$ 9.58

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For just $ 9.58 , buy BST-A11 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 8/8 Plus from the wholesale webshop online.

Specifications

Condition OEM
Parts Type Others
Gross Weight 0.011kg
Volume Weight 0.009kg
Length 10.000cm
Width 8.000cm
Height 0.500cm
Weight 0.010kg
With Retail Packaging Yes

Product Description

BST-A11 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 8/8 Plus
  • Made by high quality steel material

  • The stepped grooves can quickly adjust the tin sweating location of IC beads

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-A11 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template
BST-A11 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 8/8 Plus-1

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