Price:
$ 1.94

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For just $ 1.94 , buy BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9 from the wholesale webshop online.

Specifications

Condition OEM
Parts Type Others
Gross Weight 0.011kg
Volume Weight 0.009kg
Length 10.000cm
Width 8.000cm
Height 0.500cm
Weight 0.010kg
With Retail Packaging Yes

Product Description

BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
  • Made by high quality metal material

  • Easy and quickly for reballing the BGA IC

  • Excellent to replace IC or BGA rework reballing

Package included:

  • 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9-1

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